Heidelberg
The DWL 66+ Laser Lithography

The versatile tool for research and prototyping, with variable resolution and a large selection of modules for easy customization.

Product Desription

The DWL 66+ laser lithography tool is a high-resolution direct-write pattern generator. As an allrounder, the DWL 66+ is ideal for research and development (R&D) in microelectronics, MEMS, microfluidics, sensors, non-standard substrates, advanced packaging — virtually any academic application that requires microstructure fabrication. The DWL 66+ stands out with its Grayscale Exposure Mode which creates complex 2.5D microstructures such as micro-optics for mobile applications, diffraction optical elements (DOE), computer-generated holograms, and structured surfaces.

It is a highly flexible and customizable system that precisely matches the requirements of your applications. Among the key features of the DWL 66+ are a High-Resolution Mode, front- and backside alignment, absolute position calibration and an automatic loading system.

Product Highlights

Exposure Quality
CD uniformity 60 nm; edge roughness 50 nm; 2nd layer alignment 500 nm; autofocus compensation 80 µm


Grayscale Lithography
Up to 1000 gray levels; dedicated GenISys BEAMER software for optimizing the exposure of complex geometries

Versatility
Choice of 6 write modes with 2 laser wavelengths; 3 grayscale exposure regimes; highest amount of additional modules available including automation options

Application

6 Write Modes
Min. features from 300 nm to 4 µm

Exposure Wavelength
Diode laser at 375 nm or 405 nm

Autofocus
Air-gauge or optical autofocus for perfect exposure of small samples (less than 10 mm)

Variable substrate
Size from 3 mm to 230 mm

2 Grayscale Modes
Up to 1000 gray levels and a dedicated GenISys BEAMER software for optimizing the exposure of complex geometries

High-Accuracy Option
Various technical measures to improve the thermal stability and position accuracy of the stage’s coordinate system. Improved specifications for 2nd layer alignment: 350 nm

Automatic Loader
Handling of masks up to 7″ and substrates up to 8″. Optional second cassette station. Pre-aligner and wafer scanner available

Basic Freeform (BFF)
Exposures on non-planar substrates with features down to 3 μm. Typical applications are microstructures on top of convex or concave lenses

Vector Scan Mode
Patterns structures and shapes consisting of curved lines where smooth contours are required