Prototyping and Packaging
Packaging provides electrical or mechanical access to microdevices from the outside world, and also protects microdevices from environmental factors such as dust, moisture, and chemicals.
At n2STAR Cleanroom, we offer wafer dicing, wafer scribing, wire bonding, and parylene deposition techniques. We also have a PCB (printed circuit board) prototyping system available.
Packaging is a crucial step in the production of microdevices, as it ensures the reliability and performance of the final product.
