OEG MR-200 MICRO
DIAMOND SCRIBER
Manual scribing for precise cutting of structured silicon wafers.
Product Desription
The MR200 is a micro diamond scriber. It is equipped with a diamond point that is used for cutting structured silicon wafers accurately. The cutting strength can be adjusted.
The surface is partially cut and then the scratched surface is cut into individual pieces by the “breaking” step.
Product Highlights
Control of the scribing diamond by foot-switch.
Adjustable height of scribing diamond (for different specimen thicknesses).
Vacuum-waferchuck.
90°-fixed rotation of wafer chuck.
Application
Cutting samples and wafers with high precision.
Maximum sample size:
200 x 200 mm
Wafer thickness
up to 2 mm
Materials:
Silicon, sapphire, glass, quartz.
