Automatic Dicing Saw
The Disco DAD3221 Automatic Dicing Saw is used to cut wafers and glass substrates up to 6” in diameter. It is equipped with a 2 kW 40,000 r/m spindle that holds hubless blades. The dicer has a Y-axis indexing precision of 1 µm (Pitch error of 5 µm), and X-axis positioning precision of 1 mm, with a maximum feed speed of 800 mm/sec. The total vertical stroke is 32.2 mm, with 1 µm indexing precision. The maximum rotational range is 90°, with 0.08° steps.
Because image recognition functions, such as auto alignment, auto focus, auto kerf check, are installed as a standard specification, it is possible to minimize operator labor costs.
The high-speed, high-accuracy NCS (Non-Contact Setup, optional) reduces blade height measurement time for the processing table by 74%. Further processing quality stabilization is achieved through improved measurement accuracy. In addition, the visibility during kerf check was improved by enabling microscope ring light three-channel switching.
Cutting range : 160 mm
Cutting speed : 0.1～800 mm/s
Cutting range : 162 mm
Index step : 0.0001 mm
Index positioning accuracy : 0.005/160 mm
Max. stroke : 32.2 mm（Φ2 inch blades）
Moving resolution : 0.000002 mm
Repeatability accuracy : 0.001 mm
Max. rotating angle : 320 degree
Revolution speed range : 3,000 ～ 40,000 min-1