Deposition

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Deposition

Plasma-Enhanced Chemical Vapor Deposition
Magnetron Sputtering
RF Sputtering
E-beam Evaporation

At n^2STAR Cleanroom, the deposition area is designed with separate systems for different materials (metal, dielectric, magnetic, semiconductor) to minimize cross-contamination between processes. Within a maximum deviation tolerance of 5%, any wafer can be coated up to a 6-inch diameter. Samples can be treated up to 1200 C in seconds to prevent diffusion and enhance film quality.