Packaging provides electrical or mechanical access to microdevices from the outside world, and also protects microdevices from environmental factors such as dust, moisture, and chemicals.
At n^2STAR Cleanroom, we offer wafer dicing, wafer scribing, wire bonding, and parylene deposition techniques. We also have a PCB (printed circuit board) prototyping system available.
Packaging is a crucial step in the production of microdevices, as it ensures the reliability and performance of the final product.