Electrical connection is provided with Wire Bonding technique, which is the oldest and most widely used interconnection technology in semiconductor packaging.
Wire bonding is the process of creating electrical interconnections between semiconductors (or other integrated circuits) and silicon chips using bonding wires, which are fine wires made of materials such as gold and aluminium.
The two most common processes are ball bonding and wedge bonding.
Easy conversion between wedge and ball configuration.
Adjustable work holder height for added flexibility.
Supports a wide range of wire and ribbon size.
Semi-automatic and manual operation modes
Touch-screen interface
Individual bond parameter control Program storage and the capability to handle a wide range of wire diameters From 18 to 75-micron diameter wire and up to 250 x 25-micron ribbon.
Ultrasonic Wedge-Wedge bonder for wire & ribbon bonding
Bonds Aluminium, Gold, Copper and Silver wire processes
Programmable looping profiles including lange-coupler mode
30/45 and 90 (deep access) degree wire feed configurations
Consistent tail length control with fine adjust
Simple to use semiautomatic and manual operation modes