The Kurt J. Lesker Company® PVD 75 is a modular, full featured thin film deposition system allowing 6″ wafers and pieces.
The Kurt J. Lesker Company® PVD 75 is used for oxide film sputtering and has a capacity of up to 6 targets. Additionally, this system has a special attachment called Speedflo. With this attachment, it is possible to arrange the oxygen percentage in the plasma thereby increasing the deposition rate and uniformity.
Speedflo, an advanced reactive feedback control system delivering improvements to deposition rates, coating properties and process reliability.
High Vacuum and UHV Compatible
Pneumatically actuated, low profile CDS (Compact Dome Shutter) limits cross contamination between adjacent sputter sources
Typical source to substrate distance of 4″-6″ (102-152mm), manually adjustable
A total of six 2’’ sources available
Low operating pressure capability ≥ 0.5mTorr (material dependent)
Variable speed, motor driven rotating platen (up to 20 rpm)
O2 compatible
1000 W DC and 300W RF
Single standard crystal sensor controls the film thickness
ZnO, In-Sn,