The Kurt J. Lesker Company® PVD 75 Magnetron sputtering device can include up to 6 magnetron sputtering sources which are 2 inches. This device has a low operating pressure capability of 0.5 mTorr (material dependent). The coated thickness can be monitored instantaneously via Film Thickness Monitor.
The Kurt J. Lesker Company® PVD 75 is a modular, full featured thin film deposition system allowing 6″ wafers and pieces.
High Vacuum and UHV Compatible
Pneumatically actuated, low profile CDS (Compact Dome Shutter) limits cross contamination between adjacent sputter sources
Typical source to substrate distance of 4″-6″ (102-152mm), manually adjustable
A total of six 2’’ sources available
Low operating pressure capability ≥ 0.5mTorr (material dependent)
Variable speed, motor driven rotating platen (up to 20 rpm)
O2 compatible
1000 W DC and 300W RF
Single standard crystal sensor controls the film thickness
Al, Ti, Ni, Au, Cr, W can be deposited