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HeidelbergDWL 66 +

The versatile tool for research and prototyping, with variable resolution and a large selection of modules for easy customization.

PRODUCT DESCRIPTION

The DWL 66⁺ laser lithography tool is a high-resolution direct-write pattern generator. As an allrounder, the DWL 66⁺ is ideal for research and development (R&D) in microelectronics, MEMS, microfluidics, sensors, non-standard substrates, advanced packaging — virtually any academic application that requires microstructure fabrication. The DWL 66⁺ stands out with its Grayscale Exposure Mode which creates complex 2.5D microstructures such as micro-optics for mobile applications, diffraction optical elements (DOE), computer-generated holograms, and structured surfaces.

It is a highly flexible and customizable system that precisely matches the requirements of your applications. Among the key features of the DWL 66⁺ are a High-Resolution Mode, front- and backside alignment, absolute position calibration and an automatic loading system.

PRODUCT HIGHLIGHTS

Exposure Quality

CD uniformity 60 nm; edge roughness 50 nm; 2nd layer alignment 500 nm; autofocus compensation 80 µm

Grayscale Lithography

Up to 1000 gray levels; dedicated GenISys BEAMER software for optimizing the exposure of complex geometries

Versatility

Choice of 6 write modes with 2 laser wavelengths; 3 grayscale exposure regimes; highest amount of additional modules available including automation options

AVAILABLE MODULES

6 Write Modes

Min. features from 300 nm to 4 µm

Exposure Wavelength

Diode laser at 375 nm or 405 nm

Autofocus

Air-gauge or optical autofocus for perfect exposure of small samples (less than 10 mm)

Variable substrate

Size from 3 mm to 230 mm

2 Grayscale Modes

Up to 1000 gray levels and a dedicated GenISys BEAMER software for optimizing the exposure of complex geometries

High-Accuracy Option

Various technical measures to improve the thermal stability and position accuracy of the stage’s coordinate system. Improved specifications for 2nd layer alignment: 350 nm

Automatic Loader

Handling of masks up to 7″ and substrates up to 8″. Optional second cassette station. Pre-aligner and wafer scanner available

Basic Freeform (BFF)

Exposures on non-planar substrates with features down to 3 μm. Typical applications are microstructures on top of convex or concave lenses

Vector Scan Mode

Patterns structures and shapes consisting of curved lines where smooth contours are required