LPKF ProtoLaser U4 uses a scanner-guided laser with a wavelength of 355 nm in the UV spectrum. This wavelength makes it possible for many material groups to be perfectly processed with the laser without additional tools, masks or films. Placing scan fields next to each other results in a working range of up to 229 mm x 305 mm x 10 mm. The laser focus with a diameter of approx. 20 µm allows for structures with a pitch of 65 µm (50 µm line width, 15µm apart) related to FR4 with 18 µm Cu. This laser system is stable in the lower power range so that even thin and organic layers can be processed with minimal heat transfer.

The system also includes a rapid vision system for laser micro material processing and for detecting fiducials and geometric structures on the substrate.